PVD - SPUTTERING

It’s a metal deposition system originally used only on substrates with level surfaces, instead now it’s applied also on tridimensional pieces but with easy shapes and structures.

The deposition source is a magnetic cathode with a metallic plate (target – made of the material that it’s required to deposit) installed on it.
The magnetic cathode is generally located on one side of the process chamber. The substrates rotate in front of the source. When is reached the required
vacuum value it’s set a high voltage and it’s injected Argon gas.
The Argon positive ions are undergone to an acceleration process on the negative cathode and due to that they expel the atoms from the metallic plate.
Then these atoms condensate on the substrates.

                    Functioning pattern of Sputtering process


The magnetic cathode, as a deposition source, can has various shapes: circular, cylindrical, rectangular.
Depending on the application demands is planned the best solution in terms of quality and productivity.